NordTIM: A Solution for reliability and service life prediction of TIMs
Using an AI-driven continuum model, NordTIM is a three-dimensional kinetic solver that helps our customer to address their product design and development challenges for Thermal interface materials (TIMs) used in electronic boards. The solver predicts oxidative degradation rates in combined mechanical-thermal environments. The solver can also be used for Miniaturization in microelectronics which is an essential step in the compaction process of any electronic system.
Thermal interface materials (TIMs) are an important enabler for low thermal resistance and reliable electronics packaging for a wide array of applications. These materials remove air gaps and aid in optimized heat transfer to improve cooling and improve the reliability of the application significantly. There is a trend towards bonded interface materials (BIMs) because of their potential for low thermal resistance (<1 mm2-K/W). However, due to the coefficient of thermal expansion mismatches between various layers of a package, thermomechanical stresses are induced in BIMs, and the package can be prone to failures and integrity risks. Deteriorated interfaces can result in high thermal resistance in the package and degradation and/or failure of the electronics. Studies show that runaway heat causes more than 50% of all electronic system failures. With proper thermal management, we can dramatically drive down the number of electronic system failures.
Therefore, it is desirable to develop power electronics modules that are reliable in continuous operation at an ambient temperature of 150 °C and above for periods of several years. From a life cycle viewpoint, the long-term reliability of these TIMs, which are polymer-based materials, is a concern for the industry. Such estimations for requalification purposes are very challenging because they are subjected to both thermally and mechanical degradation while in use under combined environmental conditions, meaning conditions that usually cannot be covered by short-term accelerated aging tests. To address this issue, Nordisch developed a state-of-the-art technology to estimate the lifetimes or remaining performance accurately and evaluate the reliability of TIMs exposed to extreme conditions. NordTIM is compatible with FEA solvers such as Abaqus, Ansys, and MOOSE.
Bellow shows the simulation of unaged and aged Silicon-based TIMs used in an electronic board that attached the capacitor to the cover. The TIM used in this simulation subjected to multiple thermal cycling conditions at 80C for 20, 30 and 50 days at a fixed mechanical loading.
